The Race for 2nm Supremacy: TSMC, Samsung, and Intel's Next Battle

The global race to achieve supremacy in next-generation 2-nanometer (nm) semiconductors is set to accelerate in the latter half of 2025. Leading foundries, Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung Electronics, are poised to kickstart mass production during this period, positioning themselves as leaders in the advanced semiconductor landscape. In a parallel effort, Intel is gearing up to outpace its competitors with the introduction of its even more advanced 1.8nm process technology.

According to a report from The Korea Herald, TSMC has already commenced accepting client orders for its 2nm process node, with production slated to take place at its Baoshan and Kaohsiung facilities in Taiwan later in the year. This development marks a significant milestone for TSMC, as it will utilize gate-all-around (GAA) transistor architecture for the first time in its 2nm chips. The new node is expected to deliver 10-15% better performance, 25-30% lower power consumption, and a 15% boost in transistor density compared to the current 3nm technology.

Meanwhile, Samsung Electronics, also planning to start mass production of its 2nm chips in the second half of 2025, confirmed in its latest earnings report that it will produce mobile chips with the 2nm node this year. Industry speculation suggests these could be the Exynos 2600 chips, anticipated to power the future Galaxy S26 series by early 2026. Samsung, having struggled with low yield rates for its 3nm chips, aims to leverage its earlier experiences to enhance its 2nm production efficiency.

(With inputs from agencies.)