izmomicro Revolutionizes Silicon Photonics Packaging
izmomicro, a division of izmo Ltd., has achieved a significant milestone in silicon photonics packaging, marking a breakthrough in India's semiconductor ecosystem. Their platform supports 32-channel fiber input/output with minimal signal loss, aiding AI and telecommunications advancements. izmomicro's innovations boost energy-efficient data solutions globally.
In a landmark achievement, izmomicro, a specialized division of izmo Ltd., has announced a significant breakthrough in silicon photonics packaging. This milestone cements its role as a pioneer in the Indian semiconductor landscape, advancing the country's standing in the global competition for next-gen data and AI infrastructure.
izmomicro's new high-density platform supports 32-channel fiber input and output, featuring an industry-leading insertion loss of less than 2 dB. This breakthrough tackles one of the industry's most daunting challenges, involving nanometer-scale optical alignment, advanced assembly processes, and the seamless integration of electronics.
The module's 32 DC I/Os, 4 RF I/Os, and high-speed RF performance up to 70 GHz set new standards for integrating photonic and electronic systems. This innovation is poised to transform the global silicon photonics market, which is anticipated to grow significantly, driven by increased demand for high-performance data solutions.
(With inputs from agencies.)
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