Odisha Welcomes India's First Advanced Glass Semiconductor Packaging Unit
Odisha Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw will inaugurate India's first advanced glass semiconductor packaging unit. The Rs 1,943 crore project is expected to position Odisha as a leader in semiconductor innovation, producing 50 million units annually and generating 2,500 jobs.
Devdiscourse News Desk | Bhubaneswar | Updated: 18-04-2026 19:03 IST | Created: 18-04-2026 19:03 IST
- Country:
- India
Odisha is set to become a hub of semiconductor innovation as Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw inaugurate the country's first advanced glass semiconductor packaging unit.
The groundbreaking project, with an outlay of Rs 1,943 crore, aims to place Odisha at the forefront of next-generation semiconductor technology.
The plant will produce 50 million units annually, serving key sectors like aerospace, defence, artificial intelligence, and 5G, while generating approximately 2,500 jobs in the region.
(With inputs from agencies.)
Advertisement
ALSO READ
We need to take India-Netherlands cooperation in areas of Innovation, investment, sustainability and defence to new heights: PM Modi.
India Invites Dutch Innovation: Modi Champions New Era of Collaboration
Tata Electronics and ASML Forge Landmark Partnership to Boost Chip Manufacturing in India
Jitendra Singh Highlights India’s Healthcare Innovation Push at SCTIMST Convocation in Kerala
Samsung Electronics and Labour Union Resume Crucial Pay Talks

