Odisha Unveils India's First 3D Semiconductor Packaging Plant: A Step Towards Self-Reliance
In Bhubaneswar, India's inaugural 3D semiconductor packaging facility has been launched, promising to produce 70,000 glass panels annually. The Rs 1,943.53 crore investment aims to bolster sectors like AI and defense while creating 2,500 jobs. Odisha emerges as a significant player in advanced electronics.
The foundation stone for India's first advanced 3D semiconductor packaging unit was laid in Bhubaneswar by Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw. This milestone event signals Odisha's growing prominence in advanced electronics and semiconductor manufacturing.
Slated to produce 70,000 glass panels and 50 million assembled units annually, the facility represents a Rs 1,943.53 crore investment, supported by central and state funds. It will generate around 2,500 jobs, contributing significantly to Odisha's economy and India's semiconductor value chain.
This project reflects Odisha's transition into a technology-driven economy, poised to support critical sectors like AI, defense, and telecommunications. Despite political criticism, the initiative highlights Odisha's advancement in the semiconductor market and its integration into India's larger electronic manufacturing narrative.
(With inputs from agencies.)
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