LG Electronics Ventures into Next-Gen Semiconductor Equipment with Hybrid Bonding Technology

LG Electronics is making strides in the semiconductor sector as it embarks on the development of high-bandwidth memory (HBM) semiconductor equipment. A recent report by Pulse, the English service of Maeil Business Newspaper Korea, highlights the company's full-scale advancement of the hybrid bonder, touted as a pivotal innovation in next-generation chip production.

The South Korean electronics giant is pivoting towards business-to-business (B2B) qualitative growth, creating synergy across semiconductor solutions, HVAC systems, and chip equipment operations. According to industry insiders, LG has teamed up with Inha University, Gyeongbuk Technopark, and several small equipment manufacturers for a national project to develop HBM hybrid bonding technology, with commercialization anticipated by 2030.

This technological leap comes after a decade of R&D led by LG's production technology center. The hybrid bonder, which bonds DRAM layers without bumps, enhances power efficiency and processing speed. LG aims to expand its semiconductor equipment portfolio, integrating tools like precision laser systems and high-speed inspection machines to bolster the AI data center and semiconductor ecosystem while driving AI infrastructure support.